PHOTONICS 2019

In conjunction with SC19
November 18th, 2019, Denver, USA

[Keynote] Silicon Photonics: Technology Advancement and Applications

Dr. Jin Hong, VP of Data Center Group, GM of Silicon Photonics R&D, Intel Corporation

Invited Speakers

John Shalf, Lawrence Berkeley National Laboratory
Martin Suchara, Argonne National Laboratory
Ashkan Seyedi, Hewlett Packard Enterprise
Yuichi Nakamura, NEC Corporation
Tohru Ishihara, Nagoya University
Laurent Daudet, LightOn
Fumiyo Takano, NEC Laboratories
Yaoyao Ye, Shanghai Jiao Tong University
Georgios Zervas, University College London
Ming C. Wu, University of California, Berkeley
Jiang Xu, Hong Kong University of Science and Technology
Truong Thao Nguyen, Japan's National Institute of Advanced Industrial Science and Technology

Computing systems, from HPC and data center to automobile, aircraft, and cellphone, are integrating growing numbers of processors, accelerators, memories, and peripherals to meet the burgeoning performance requirements of new applications under tight cost, energy, thermal, space, and weight constraints. Recent photonic advances promise great energy efficiency, ultra-high speed, and low latency to alleviate inter-rack/board/chip communication bottlenecks and innovate optical computing for post-Moore's Law information systems.

Silicon photonics technologies piggyback onto developed silicon fabrication processes to provide viable and cost-effective solutions. Many companies and institutes have been actively developing silicon photonics technologies for more than a decade. A large number of silicon photonics devices and circuits have been demonstrated in CMOS-compatible fabrication processes. Silicon photonics technologies open up new opportunities for applications, systems, architectures, design techniques, and design automation tools to fully explore new approaches and address the challenges of post-Moore's Law information systems. PHOTONICS (Photonics-Optics Technology Oriented Networking, Information, and Computing Systems) presents the latest progresses and provides insights into the challenges and future developments of this emerging area.