Thermal sensitivity is a key characteristic and potential issue of photonic devices used by optical interconnect networks, such as in-rack optical interconnect and inter/intra-chip optical networks. We developed OTemp (Optical Thermal Effect Modeling Platform) to systematically model and analyze the performance of optical interconnects under temperature variations. OTemp is open-source and implemented in C++.
OTemp models the thermal effects at photonic device level. It can analyze arbitrary optical interconnects using either a single wavelength or multiple wavelengths such as WDM. OTemp can perform both worst-case and average-case analysis. The following diagram is an overview of OTemp.
Project Member: Peng Yang, Jiang Xu, Zhehui Wang, Luan H.K. Duong, Zhifei Wang, Haoran Li, Rafael Kioji Vivas Maeda, Xuanqi Chen, Zhongyuan Tian
Maintained by: Peng Yang (firstname.lastname@example.org). If there is any inquiry or suggestion, please do not hesitate to contact us.
Past Member: Yaoyao Ye, Zhe Wang, Xuan Wang, Mahdi Nikdast, Xiaowen Wu
Or you can download the full package directly.
OTemp is made openly available under the following license. Please cite the following paper if it is used.
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